医用接插件模具设计及工艺优化

聂五四, 刘淑梅, 汪东亮, 张春, 徐春飞

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PDF(3393 KB)
塑料科技 ›› 2025, Vol. 53 ›› Issue (03) : 145-151. DOI: 10.15925/j.cnki.issn1005-3360.2025.03.026
塑机与模具

医用接插件模具设计及工艺优化

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Die System Design and Process Optimization of Medical Connector

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摘要

以一款医用接插件为例,设计一套一模两腔的四面滑块抽芯两板模。整套模具的主要结构包括分型面、成型零件、浇注系统、抽芯机构和其他系统部分。为进一步提高产品质量和满足二次注射热固性液态硅胶所需的尺寸要求,通过响应面法,以保压压力、模具温度和熔体温度为影响因素,以翘曲变形作为响应目标,通过BBD设计实验方案,使用Moldflow软件进行仿真实验,通过Design Expert软件分析数据,获得最佳工艺参数为:保压压力104.549 MPa、模具温度81.086 ℃、熔体温度304.750 ℃。使用该工艺参数生产的医用接插件翘曲变形下降27.2%。

Abstract

Taking a medical connector as an example, a four-sided sliding block core-pulling two-plate mold with one die and two cavities was designed. The main structure of the whole set of mold included parting surface, forming parts, pouring system, core pulling mechanism and other system parts. In order to further improve product quality and meet the size requirements required for secondary injection of thermoset liquid silica gel, the paper adopted the response surface method, took the holding pressure, mold temperature and melt temperature as the influence factors, and took the warpage deformation as the response target. BBD design experimental scheme was adopted, and Moldflow software was used to conduct simulation experiments. The Design Expert software analyzed the data, and the optimal process parameters were obtained as follows: Holding pressure 104.549 MPa, mold temperature 81.086℃ and melt temperature 304.750 ℃. The warpage deformation of the medical connector produced by this process parameter was decreased by 27.2%.

关键词

接插件 / 注塑模具设计 / Moldflow / 响应面法 / 翘曲变形

Key words

Connector / Injection mold design / Moldflow / Response surface method / Warpage deformation

中图分类号

TQ320.5+ 2 / TP391.7

引用本文

导出引用
聂五四 , 刘淑梅 , 汪东亮 , . 医用接插件模具设计及工艺优化. 塑料科技. 2025, 53(03): 145-151 https://doi.org/10.15925/j.cnki.issn1005-3360.2025.03.026
NIE Wusi, LIU Shumei, WANG Dongliang, et al. Die System Design and Process Optimization of Medical Connector[J]. Plastics Science and Technology. 2025, 53(03): 145-151 https://doi.org/10.15925/j.cnki.issn1005-3360.2025.03.026

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