为了研究和提升聚烯烃树脂基板的可加工性，文章对制备的一款聚烯烃类基板产品进行讨论，介绍了其生产工艺流程，并重点分析了板材的耐湿热性、力学强度和电学性能等，分析各性能的影响因素和改进措施。结果表明：通过引入无机填料（质量分数40%~70%），并使用1.5%的硅烷偶联剂处理填料界面，热分解温度（失重5%）在414.2 ℃，吸水率可降至0.06%，可以提高板材的耐湿热性。选用平均粒径在5 μm的SiO₂填料，弯曲强度在310 MPa，抗剥强度在0.8 N/mm，不同孔径钻孔均孔型良好。树脂体系中引发剂的含量控制在2.0%左右，可以保证板材长时间具备良好的电性能和较低的热膨胀系数（CTE）。通过优化配方或调控工艺，板材各项指标均能满足印制电路板（PCB）加工要求，较好地满足市场要求。

In order to study and improve the processability of polyolefin resin substrates, a polyolefin based substrate product was discussed, and its production process was introduced. The focus was on analyzing the moisture heat resistance, mechanical strength, and electrical properties of the board, analyzing the influencing factors and improvement measures of each performance. The results show that by introducing inorganic fillers (mass ratio 40%~70%) and using 1.5% silane coupling agent to treat the filler interface, the thermal decomposition temperature (weight loss 5%) is at 414.2 ℃, and the water absorption rate can be reduced to 0.06%, which can improve the moisture heat resistance of the board. Choose an average particle size of 5 μm SiO₂ filler, the bending strength is 310 MPa, the peel strength is 0.8 N/mm, and the drilling holes with different apertures have good pore shapes.. The content of initiator in the resin system is controlled at around 2.0%, which can ensure that the board has good electrical properties and low CTE for a long time. By optimizing the formula or regulating the process, the indicators of the board can meet the requirements of printed circuit board (PCB) processing and better meet market requirements.