液晶聚芳酯（LCP）主链的刚性棒状结构使其熔体黏度低，不利于薄膜的加工成型。通过聚四氟乙烯（PTFE）对LCP共混改性，以期增强LCP的熔体黏度，使制品具备良好的力学性能、尺寸稳定性与高频低介电性能。共混物的流变性能结果表明，熔体黏度随着PTFE比例的增加而显著增大。制备薄膜的介电性能结果表明，PTFE的添加可显著降低共混物薄膜的介电常数和介电损耗。1 MHz条件下，LCP/5%PTFE共混物薄膜的介电常数和介电损耗分别为3.15和0.013 5，相比纯LCP降低7.1%和24.9%。扫描电子显微镜（SEM）图像表明，高黏度PTFE的混入限制了LCP原有的长程纤维状结构的产生。此外，热性能测试结果显示，共混物的熔点和降解温度均随PTFE共混比例的增加而提高。

Liquid crystal polyarylate (LCP) possesses very low melt viscosity due to the rigid rod-shaped structure of its main chain, which is not beneficial for film processing and molding. The study aims to enhance the melt viscosity of LCP through blending modification with polytetrafluoroethylene (PTFE), while ensuring excellent mechanical properties, dimensional stability, and low dielectric performance at high frequencies. Rheological properties results of the blends indicate that the melt viscosity gradually increases with the addition of PTFE. Dielectric properties results of the prepared thin films indicate that the incorporation of PTFE significantly reduces the dielectric constant and dielectric loss of the blend films. The LCP/5%PTFE blend film possesses a dielectric constant of 3.15 and a dielectric loss of 0.013 5 under the condition of 1 MHz, representing a decrease of 7.1% and 24.9% compared to pure LCP. SEM images reveal that the incorporation of high-viscosity PTFE restricts the formation of the original long-range fibrous structure of LCP. Furthermore, thermal performance test results indicate that both the melting point and degradation temperature of the blends increase with an increasing proportion of PTFE in the blend.