采用苯乙烯-马来酸酐共聚物（SMA）接枝到二氧化硅纳米粒子上，通过两步法制备聚碳酸酯/丙烯腈-丁二烯-苯乙烯共聚物（PC/ABS）共混材料，探究SMA共聚物对PC/ABS共混材料热膨胀系数（CTE）和冲击强度的影响。结果表明：SMA共聚物的掺入，导致PC/ABS共混材料的流动性变差，而其耐热性增强。同时，随SMA掺量的增加，PC/ABS共混材料的CTE均较S0有不同程度的降低，其中S1、S2、S3和S4的CTE较S0分别降低了19.8%、44.5%、43.1%、41.4%。SMA共聚物的加入有效提升了PC/ABS复合材料的LOI数值，其中S2试样具有最高的LOI数值，为28.8%，且UL-94测定结果为V-0，未出现滴落现象。此外，随着SMA共聚物掺量的增加，PC/ABS共混材料的拉伸强度呈现先上升后小幅度降低的趋势，弯曲强度呈现先上升后稳定变化的趋势，断裂伸长率呈现先下降后稳定变化的趋势，缺口冲击强度呈现一直上升的趋势。其中，S2试样具有最高的拉伸强度、弯曲强度和较高的缺口冲击强度，分别为41.6 MPa、102.4 MPa和15.3 J/m²，分别较S0试样的对应参数增加了29.6%、10.7%和1.35倍。

Using styrene maleic anhydride copolymer (SMA) grafted onto silica nanoparticles, polycarbonate/acrylonitrile butadiene styrene copolymer (PC/ABS) blends were prepared by a two-step method, and the effect of SMA copolymer on the coefficient of thermal expansion (CTE) and impact strength of PC/ABS blends was investigated. The results showed that the addition of SMA copolymer resulted in a decrease in the flowability of PC/ABS blends, while their heat resistance was enhanced. Meanwhile, with the increase of SMA content, the CTE of PC/ABS blends decreased to varying degrees compared to S0, among which the CTE of S1, S2, S3 and S4 respectively decreased by 19.8%, 44.5%, 43.1%, and 41.4% compared to S0. The addition of SMA copolymer effectively improved the LOI value of PC/ABS composites, with S2 sample having the highest LOI value of 28.8%, and the UL-94 measurement result was V-0, with no dripping observed. In addition, with the increase of SMA copolymer content, the tensile strength of PC/ABS blends shows a trend of first increasing and then slightly decreasing, the bending strength shows a trend of first increasing and then stabilizing, the elongation at break shows a trend of first decreasing and then stabilizing, and the notch impact strength shows a continuous upward trend. Among them, the S2 sample has the highest tensile strength, bending strength, and high notch impact strength, with values of 41.6 MPa, 102.4 MPa, and 15.3 J/m², respectively, which are 29.6%, 10.7%, and 1.35 times higher than the corresponding parameters of the S0 sample.