
Al2O3含量对PTFE/SiO2复合薄膜性能的影响
李强, 金霞, 王维文, 冯春明
Al2O3含量对PTFE/SiO2复合薄膜性能的影响
Effect of Al2O3 Content on Performances of PTFE/SiO2 Composite Films
多层电路板存在散热性能较差的问题,限制其在高频电路中的应用。实验以Al2O3为填料,制备了聚四氟乙烯(PTFE)/SiO2高导热复合薄膜材料,用于增强多层电路板的导热性能。将不同添加量的Al2O3加入PTFE中,采用浸渍工艺结合高温烧结制备PTFE/SiO2复合薄膜,研究Al2O3含量对PTFE/SiO2复合薄膜的微观形貌、密度、导热性能、力学性能的影响。结果表明:随着Al2O3含量的提高,复合薄膜的导热系数呈现上升趋势,密度和力学强度均呈现先升高后下降的趋势。当Al2O3含量为4%时,PTFE/SiO2复合薄膜(样品3)的微观缺陷最少,具有最高的密度和力学强度,同时具有较为合理的导热系数和电绝缘性。样品3的密度为2.119 g/cm3,力学强度为17.3 MPa,导热系数为0.98 W/(m·K),体积电阻率为380.9 GΩ·m。
Multi-layer circuit board has the problem of poor heat dissipation performance, which limits its application in high frequency circuit. In this experiment, polytetrafluoroethylene (PTFE)/SiO2 high thermal conductivity composite film materials were prepared with Al2O3 as filler to enhance the thermal conductivity of multi-layer circuit boards. PTFE/SiO2 composite films were prepared by impregnation process combined with high temperature sintering by adding different amounts of Al2O3 into PTFE. The effects of Al2O3 content on the microstructure, density, thermal conductivity and mechanical properties of PTFE/SiO2 composite films were studied. The results show that with the increase of Al2O3 content, the thermal conductivity of the composite film shows an upward trend, and the density and mechanical strength show a trend of increasing first and then decreasing. When the Al2O3 content is 4%, the PTFE/SiO2 composite film (sample 3) has the least micro-defects, the highest density and mechanical strength, and has a reasonable thermal conductivity and electrical insulation. The density of sample 3 is 2.119 g/cm3, the mechanical strength is 17.3 MPa, the thermal conductivity is 0.98 W/(m·K), and the volume resistivity is 380.9 GΩ·m.
三氧化二铝 / PTFE / 导热性能 / 力学性能 / 体积电阻率
Al2O3 / PTFE / Thermal conductivity / Mechanical property / Volume resistivity
TM211
1 |
杜江坤.基于多层印制板的微波信号高密度传输与控制技术[D].成都:电子科技大学,2018.
|
2 |
杨维生.微波多层化构建之热塑性黏结片压合技术[J].印制电路信息,2018,26(10):17-27.
|
3 |
WANFC,
|
4 |
|
5 |
|
6 |
杨维生.微波多层化构建之热固性黏结片压合技术[J].印制电路信息,2017,25(3):43-50.
|
7 |
谭友洪.聚四氟乙烯基高频覆铜板制备及性能研究[D].重庆:重庆理工大学,2023.
|
8 |
金霞,贾倩倩,张立欣,等.低温度系数PTFE/SiO2复合材料的制备及介电性能优化[J].塑料科技,2021,49(4):15-19.
|
9 |
|
10 |
师剑英.浅析高频覆铜板的开发要点(二)[J].覆铜板资讯,2018(2):32-37.
|
11 |
黄达斐,严长俊,李晓晨,等.陶瓷、PTFE基复合介质基板新成型工艺的研究[J].电子元件与材料,2014(4):17-21.
|
12 |
赵东亮,秦明礼,鲁慧峰.水基喷雾造粒制备高导热球形氮化铝填料[J].粉末冶金技术,2024,42(2):170-176.
|
13 |
徐随春,赵春宝.环氧树脂/改性氮化硼导热复合材料的制备与性能研究[J].绝缘材料,2017,50(5):16-20.
|
14 |
谭友洪.聚四氟乙烯基高频覆铜板制备及性能研究[D].重庆:重庆理工大学,2023.
|
15 |
陈鸿.聚四氟乙烯导热复合材料的制备与性能研究[D].成都:四川大学,2021.
|
16 |
潘晨.聚四氟乙烯材料介电和导热性能研究[D].西安:西北工业大学,2021.
|
17 |
张惠娟,王涛,孟维晓.氮化硼填充导热绝缘塑料的研究及应用[J].塑料工业,2019,47(6):22-26.
|
18 |
张晓星,胡国雄,伍云健,等.氮化硼纳米片改性环氧树脂导热与介电性能的研究[J].高电压技术,2021,47(2):645-651.
|
19 |
毕世杰,李喆,盛戈皞.氮化硼纳米片取向对环氧复合材料导热及绝缘性能的影响[J].绝缘材料,2023,56(5):14-19.
|
20 |
聂翔,欧阳婷.纳米氮化硼片/纤维素复合导热膜的制备及表征[J].化工新型材料,2021,49(6):70-74.
|
21 |
杨胜都,孙鑫,李毅 等.石墨烯/碳纳米管协同增强再生纤维素复合薄膜的导热性能研究[J].塑料工业,2019,47(9):147-153, 163.
|
22 |
陈瑞雪,孙艺文,尚冬梅,等.Al2O3基陶瓷纤维的制备及应用研究进展[J].棉纺织技术,2023,51(12):77-83.
|
23 |
陈厚振,王艳芝,张艳丽,等.不同尺寸氧化铝对聚丙烯复合材料性能影响及数值模拟[J].塑料科技,2022,50(11):24-29.
|
24 |
吴运香,雷霆,高纪明,等.氮化硅晶须/氮化铝颗粒/聚酰亚胺复合材料的制备及性能[J].粉末冶金材料科学与工程,2021,26(3):250-256.
|
25 |
高正源,翟帅,杜连腾,等.氧化铝填充导热复合材料的制备和性能研究进展[J].塑料科技,2023,51(12):81-87.
|
26 |
谢兆元,黄靖雅,蒲华秀.BN填充PA6高导热复合材料的性能研究[J].塑料科技,2021,49(3):21-25.
|
/
〈 |
|
〉 |