文章基于仿真技术模拟了某玻纤增强热管理系统基板的注塑成型过程，以此评估可行性及优化方案。通过分析填充阻力及浇口匹配性结果确定了最佳的进胶方案。采用初始工艺计算得到基板的定位孔变形极差为0.538 4 mm，达不到设计指标要求。以注射时间、保压时间、模腔温度及熔料温度为变量设计正交试验并进行分析。结果表明：保压时间和注射时间的影响为极显著；模腔温度的影响为显著，而熔料温度的影响不显著。优化的工艺参数组合为A₂B₂C₁D₃。优化工艺的仿真结果显示：定位孔变形极差为0.452 8 mm，下降了15.9%，且达到设计指标要求；填状态良好、无缺欠注和滞留。实际试模样品的外观良好、变形结果均合格，验证了优化工艺的正确性。

Based on simulation technology, the injection molding process of a glass fiber reinforced thermal management system substrate was simulated to evaluate the feasibility and optimize the scheme. By analyzing the filling resistance and gate matching results, the best glue feeding scheme was determined. According to the initial process calculation, the deformation range of the positioning hole of the substrate is 0.538 4 mm, which can not meet the design requirements. An orthogonal test was designed and analyzed with injection time, holding time, cavity temperature, and melt temperature as variables. The results show that the influence of holding time and injection time is extremely significant. The influence of cavity temperature is significant, but the influence of melt temperature is not significant. The optimized process parameters is A₂B₂C₁D₃. The simulation results of optimized process show that the deformation range of the positioning hole is 0.452 8 mm, which decreases by 15.9% and meets the design requirements, filling in good condition, without defects, notes and detention. The appearance of the actual sample pattern is good, and the deformation results are uniform, which verifies the correctness of the optimized process.