Droplet-on-demand and direct deposition of bumps based on pulsated orifice ejection method

Wei DONG, Zanru JIA, Fumin XU, Xudong WANG, Yang ZHAO

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Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (4) : 178-186. DOI: 10.11868/j.issn.1001-4381.2023.000167
RESEARCH ARTICLE

Droplet-on-demand and direct deposition of bumps based on pulsated orifice ejection method

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Abstract

The stability of micro-droplet ejection and size on-demand are important prerequisites for the direct preparation of bumps in chip packaging. The ejection experiment of SAC305 commercial lead-free solder is carried out by pulsated orifice ejection method （POEM）. The effects of the interaction of parameters such as the pulse waveform， the distance between the transmission rod and the orifice and the orifice， diameter on the ejection stability and particle size during the droplet ejection process are investigated. The surface morphology and microstructure， composition， and phase composition of the solder ball are analyzed. The results show that the stable ejection of droplets and the control of size-on-demand can be realized by coordinating the key process parameters. The deviation between the target particle size and the actual size is within 4%， which can meet the needs for the stable on-demand preparation of bumps. The results of temperature change during droplet solidification show that the cooling rate in the argon atmosphere is much lower than that in the helium atmosphere， so the microstructure is coarser. Combined with the above results， the bumps are directly deposited on the copper plate to form a metallurgical layer， which shows the feasibility of the technology and provides a new way for the direct preparation of bumps.

Key words

pulsated orifice ejection method / SAC305 / BGA solder ball / preparation of bumps

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Wei DONG , Zanru JIA , Fumin XU , et al . Droplet-on-demand and direct deposition of bumps based on pulsated orifice ejection method. Journal of Materials Engineering. 2025, 53(4): 178-186 https://doi.org/10.11868/j.issn.1001-4381.2023.000167

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis
[1]
李望云，秦红波， 周敏波， 等. 电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为 ［J］. 机械工程学报，2016， 52（10）：46-53.
LI W Y， QIN H B， ZHOU M B，et al. Mechanical performance and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-tensile coupled loads ［J］. Journal of Mechanical Engineering，2016，52（10）：46-53.
本文引用 [1]
[2]
王志海，钱江蓉，兰欣，等. 纳米压痕法测量SAC305焊料的力学性能 ［J］. 电子元件与材料，2020，39（6）：72-78.
WANG Z H， QIAN J R， LAN X， et al. Characterization of mechanical properties of solder joints using nanoindentation method ［J］. Electronic Components and Materials，2020，39（6）：72-78.
本文引用 [1]
[3]
REINL S. Diode lasers used in plastic welding and selective laser soldering-applications and products ［J］. Physics Procedia，2013，41：234-240.
本文引用 [1]
[4]
HIROSHI N， NORIYA I. Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag-Cu solder on a Cu pad ［J］. Journal of Materials Processing Technology，2015，215：6-11.
本文引用 [1]
[5]
LIU Q， ORME Q. High precision solder droplet printing technology and the state-of-the-art ［J］. Journal of Materials Processing Technology 2001，115（3）：271-283.
本文引用 [1]
[6]
HU Z J， LI S J， YANG F，et al. Formation and elimination of satellite droplets during monodisperse droplet generation by using piezoelectric method ［J］. Micromachines，2021，12（8）：921.
本文引用 [1]
[7]
XIONG W， QI L H， LUO J，et al. Experimental investigation on the height deviation of bumps printed by solder jet technology ［J］. Journal of Materials Processing Technology，2017，243：291-298.
本文引用 [1]
[8]
LIU M L， YI H， CAO H J，et al. Heat accumulation effect in metal droplet-based 3D printing： evolution mechanism and elimination strategy ［J］. Additive Manufacturing，2021，48：102413.
本文引用 [1]
[9]
YI H， QI L H， LUO J，et al. Hole-defects in soluble core assisted aluminum droplet printing： metallurgical mechanisms and elimination methods ［J］. Applied Thermal Engineering，2019，148：1183-1193.
本文引用 [1]
[10]
LEE T M， KANG T G， YANG J S，et al. Gap adjustable molten metal DoD inkjet system with cone-shaped piston head ［J］. Journal of Manufacturing Science and Engineering，2008，130（3）：031113.
本文引用 [1]
[11]
GILANI N， ABOULKHAIR N T， SIMONELLI M，et al. Insights into drop-on-demand metal additive manufacturing through an integrated experimental and computational study ［J］. Additive Manufacturing，2021，48：102402.
本文引用 [1]
[12]
GU S D， JIAO X Y， LIU J F，et al. Design and experiment of a solder paste jetting system driven by a piezoelectric stack ［J］. Micromachines，2016，7（7）：112.
本文引用 [1]
[13]
FENG Y M， LU J K， LI K，et al. Waveform optimization of piezoelectric micro-jet for the control of metal micro-droplet ejection ［J］. IEEE Transactions on Industrial Electronics，2021，69（4）：3967-3976.
本文引用 [1]
[14]
CHANG H J， TSAI M H， HWANG W S. The simulation of micro droplet behavior of molten lead-free solder in inkjet printing process and its experimental validation ［J］. Applied Mathematical Modelling，2012，36（7）：3067-3079.
本文引用 [1]
[15]
LUO Z W， WANG X， WANG L Y，et al. Drop-on-demand electromagnetic printing of metallic droplets ［J］. Materials Letters，2017，188：184-187.
本文引用 [1]
[16]
李颖， 董伟， 三浦彩子， 等 ．球形铁基金属玻璃单分散粒子的制备及评价 ［J］. 无机材料学报， 2012， 27（8）： 849-854．
LI Y， DONG W， MIURA A，et al ．Fabrication and characterization of mono-sized spherical Fe-based metallic glass micro-particles ［J］．Journal of Inorganic Materials，2012，27（8）：849-854．
本文引用 [2]
[17]
董伟， 李文畅， 许富民， 等. 单分散铁基 Fe60Ni7.5Mo7.5P10C10B5 金属玻璃球形粒子的制备及评价 ［J］. 材料工程， 2018， 46（10）： 30-36．
DONG W， LI W C， XU F M，et al ．Fabrication and evaluation of mono-sized Fe-based Fe60Ni7.5Mo7.5P10C10B5 metallic glass spherical micro particles ［J］．Journal of Materials Engineering，2018，46（10）：30-36．
本文引用 [4]
[18]
董伟，魏宇婷，康世薇，等. 基于脉冲微孔喷射的液滴沉积成型 ［J］. 材料工程，2016， 44（10）： 1-7.
DONG W， WEI Y T， KANG S W，et al. Droplets deposition based on pulsated orifice ejection ［J］. Journal of Materials Engineering，2016，44（10）：1-7.
本文引用 [1]
[19]
KIM K S， HAGA M， SUGANUMA K. In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy ［J］. Journal of Electronic Materials，2003，32（12）：1483-1489.
本文引用 [3]
[20]
ZHANG R J， ZHI H， WANG X Y，et al. Simulation of dendrite growth in ternary alloys ［J］. Materials Letters，2005， 59（22）： 2765-2768.
本文引用 [1]
[21]
YI H， QI L H， LUO J，et al. Effect of surface morphology of solidified droplet on remelting between neighboring aluminum droplets ［J］. International Journal of Machine Tools and Manufacture，2018，130/131：1-11.
本文引用 [1]
[22]
GILANI N， ABOULKHAIR N T， SIMONELLI N，et al. Form impact to solidification in drop-on-demand metal additive manufacturing using MetalJet ［J］. Additive Manufacturing，2022，55：102827.
本文引用 [1]
[23]
肖慧，李晓延，李凤辉. 热循环条件下SnAgCu/Cu焊点金属间化合物生长及焊点失效行为 ［J］. 材料工程，2010（10）：38-42.
XIAO H， LI X Y， LI F H. Growth kinetic of intermetallic compounds and failure behavior for SnAgCu/Cu solder joints subjected to themal cycling ［J］. Journal of Materials Engineering，2010（10）：38-42.
本文引用 [1]
[24]
刘璐，程东明，卢显丽.无助焊剂条件下SnAgCu/Cu 钎焊接头金属间化合物的生长规律 ［J］. 热加工工艺，2017，46（13）：68-71.
LIU L， CHENG D M， LU X L. Growth rule of intermetallic compound in SnAgCu/Cu brazed joint without flux ［J］. Hot Working Technology，2017，46（13）：68-71.
本文引用 [1]

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