导热阻燃复合材料有利于电子设备的高效散热并降低火灾风险，在电子产品中具有良好的应用前景。首先采用γ-氨丙基三乙氧基硅烷对SnO₂纳米粒子进行表面修饰，将制得的改性SnO₂（m-SnO₂）与碱处理和超声剥离后的氮化硼纳米片（BNNS）通过静电自组装进行结合，制备了BNNS@m-SnO₂杂化填料；随后以环氧树脂为聚合物基体利用刮膜法制备了具有一定取向结构的导热阻燃复合材料。研究表明，SnO₂纳米粒子改性后，Zeta电位从-19.1 mV变为28.7 mV，能够与Zeta电位为-27.8 mV的BNNS通过静电相互作用结合在一起；BNNS@m-SnO₂杂化填料的添加能够有效地改善环氧复合材料的导热性能和阻燃性能，其中，EP/BNNS@m-SnO₂-10%（质量分数）复合材料的导热率可达3.79 W·m^-1·K^-1，并且表现出更高的峰值燃烧温度（410.9 ℃）和更低的峰值热释放速率（302.2 W·g^-1）。

Epoxy composites that possess high thermal conductivity and synergistic flame resistance are anticipated to achieve efficient heat dissipation and minimal fire risk in electronic equipment， thereby exhibiting promising application prospects in electronic products. In this study， SnO₂ nanoparticles are modified using γ-aminopropyltriethoxysilane， and the resultant modified SnO₂ （m-SnO₂） is further integrated with boron nitride nanowires （BNNS） through electrostatic self-assembly to produce BNNS@m-SnO₂ hybrid fillers. Subsequently， thermally conductive and flame-resistant composites with a specific orientation structure are fabricated using the blade-casting method， with epoxy resin serving as the polymer matrix. The results indicate that the Zeta potential of the modified SnO₂ nanoparticles shift from -19.1 mV to 28.7 mV， enabling their combination with BNNS （Zeta potential of -27.8 mV） through electrostatic interaction. The incorporation of BNNS@m-SnO₂ hybrid fillers significantly enhances the thermal conductivity and flame resistance of the epoxy composites. Notably， the thermal conductivity of the EP/BNNS@m-SnO₂-10%（mass fraction） composites reach 3.79 W·m^-1·K^-1， while also demonstrating a higher peak combustion temperature （410.9 ℃） and a lower peak heat release rate （302.2 W·g^-1）.