镍基高温合金TLP连接接头PBHT工艺研究进展

李红, 李泊瑾, 王伯洋, HODÚLOVÁ Erika, 曹健, 李云月, 钟素娟

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材料工程 ›› 2025, Vol. 53 ›› Issue (5) : 119-129. DOI: 10.11868/j.issn.1001-4381.2022.000364
综述

镍基高温合金TLP连接接头PBHT工艺研究进展

作者信息 +

Research progress in PBHT process for nickel-based superalloy TLPB joints

Author information +
History +

摘要

瞬间液相(transient liquid phase, TLP)连接是目前用于连接镍基高温合金的一种优化技术,而连接后热处理(post-bond heat treatment,PBHT)是对连接后的接头进行的热处理工艺,本文对TLP连接中热循环对镍基高温合金母材组织性能的不利影响和TLP连接后接头存在的有害问题进行归纳汇总,对PBHT工艺的机理、种类及研究现状等进行详细分析,对其适用体系和效果进行系统评述。针对未来的PBHT工艺研究,建议继续向多级多道精准热处理的方向发展,并探索TLPB-PBHT一体化工艺。

Abstract

Transient liquid phase(TLP)bonding is an optimised bonding process that joins nickel-based superalloys. The post-bond heat treatment(PBHT)refers to a heat treatment process for the joint after the connection. This article summarizes the adverse effects of TLP thermal cycling on the tissue properties of nickel-based superalloys and the harmful phase problems of joints after TLP joining. The article explains the mechanism, types and current status of the PBHT process, analyses and discusses the systems and effects of the PBHT process where it is applicable. Finally, the development prospects and future research directions are presented. For future PBHT process research, it is recommended to continue to develop in the direction of multi-level and multi-pass precision heat treatment, and explore the TLPB-PBHT integrated process.

关键词

镍基高温合金 / 连接后处理 / 瞬间液相 / 均匀化 / 固溶处理 / 时效处理

Key words

nickel-based superalloy / TLP / PBHT / homogenisation / solution treatment / aging treatment

中图分类号

TG454 / TB31

引用本文

导出引用
李红 , 李泊瑾 , 王伯洋 , . 镍基高温合金TLP连接接头PBHT工艺研究进展. 材料工程. 2025, 53(5): 119-129 https://doi.org/10.11868/j.issn.1001-4381.2022.000364
Hong LI, Bojin LI, Boyang WANG, et al. Research progress in PBHT process for nickel-based superalloy TLPB joints[J]. Journal of Materials Engineering. 2025, 53(5): 119-129 https://doi.org/10.11868/j.issn.1001-4381.2022.000364

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基金

国家自然科学基金项目(52475316)
国家外国专家项目(H20240059)
先进焊接与连接国家重点实验室开放课题研究基金(AWJ-20-M01)
新型钎焊材料与技术国家重点实验室开放课题(SKLABFMT-2020-04)

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