Process Exploration of Fat-plastic-wood Composite Panels by One-step Forming Method

HU Jiandong, YIN Xiaofei, WU Dan, HUANG Yingchen, ZENG Haoyu, LIN Wei

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Plastics Science and Technology ›› 2025, Vol. 53 ›› Issue (01) : 115-121. DOI: 10.15925/j.cnki.issn1005-3360.2025.01.021
Process and Control

Process Exploration of Fat-plastic-wood Composite Panels by One-step Forming Method

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Abstract

The study aims to develop a one-step forming method for preparing wood-plastic composite boards. Using waste printed circuit boards (WPCB) as raw materials, wood-plastic composite profiles are prepared through processes such as non-metal screening, material mixing, and extrusion molding. The best material formulation for the pilot test was 235 kg of non-metallic powder with particle size of 0.125~0.150 mm, 105.0 kg of new HDPE, 157.5 kg of recycled HDPE, 465 kg of wood flour, 63 kg of maleic anhydride grafted polyethylene, and 20 kg of dibasic carboxylic acid fatty alcohol ester. After mixing, the hot-melt material was obtained by extruder barrel heating and screw shearing, and the hot-melt material entered into the mould for extrusion moulding through the merging core. Finally, the profile was obtained by cutting, cooling and shaping for 24 h, and its properties were determined. The optimum minimum concentrated load of the pilot-produced panel was kept above 3 100 N, the bending modulus was more than 3 700 MPa, and the water absorption rate was less than 1%. The research in this paper provides a simple and efficient method for recycling the non-metallic components of WPCB for resource utilization, and generates economic benefits while processing the non-metallic components of WPCB, and realizes the resource utilization of the non-metallic components of WPCB.

Key words

Waste printed circuit board / Non-metallic powder / One-step forming / Composite panels / Resource utilization

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HU Jiandong , YIN Xiaofei , WU Dan , et al . Process Exploration of Fat-plastic-wood Composite Panels by One-step Forming Method. Plastics Science and Technology. 2025, 53(01): 115-121 https://doi.org/10.15925/j.cnki.issn1005-3360.2025.01.021

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