Research progress of Copper Nanowire/Macromolecule Thermal Conductivity Composites

LIU Ya-xuan, HOU Jia-le, LI Xin-le, LI Zhen-qi, MA Feng-ling, SHI Shan-shan, JIANG Tao, WU Xin-feng

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Plastics Science and Technology ›› 2024, Vol. 52 ›› Issue (10) : 154-160. DOI: 10.15925/j.cnki.issn1005-3360.2024.10.030
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Research progress of Copper Nanowire/Macromolecule Thermal Conductivity Composites

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Abstract

Increasing or broadening the thermal conductivity path by constructing a thermal conductivity network is one of the common ways to prepare high thermal conductivity composites. The interlacing or orientation of copper nanowires with one-dimensional structure can be connected into a network structure, which greatly improves the heat dissipation performance of composites. In this paper, three preparation methods of copper nanowires were introduced: Template electrodeposition method, liquid phase reduction method, and direct impregnation method. The vertically oriented and network structure copper nanowires were prepared by different methods with high thermal conductivity, which can significantly improve the thermal conductivity of the materials as thermal conductive fillers. Six preparation methods of copper nanowire composites were introduced: Physical blending method, freeze-drying method, magnetic field orientation method, hot pressing method, solution casting method, and vacuum filtration method. The principles of each method wereintroduced, the influencing factors of thermal conductivity of various composite molding methods were analyzed, the different preparation methods were summarized, and the thermal conductivity properties of different preparation methods were summarized. Finally, the thermally conductive composites filled with copper nanowires were summarized and prospected.

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Copper nanowires / Thermal conductivity / Composites / Preparation methods

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LIU Ya-xuan , HOU Jia-le , LI Xin-le , et al . Research progress of Copper Nanowire/Macromolecule Thermal Conductivity Composites. Plastics Science and Technology. 2024, 52(10): 154-160 https://doi.org/10.15925/j.cnki.issn1005-3360.2024.10.030

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