
Optimization Analysis of ABS Electronic Relay Injection Molding
ZHANG Su-xin
Optimization Analysis of ABS Electronic Relay Injection Molding
In the design of plastic solutions for electronic relays, the maximum deformation after injection molding is a key parameter that needs to be controlled. This article conducts a simulation study on the injection molding and deformation of an ABS electronic relay housing. Obtain the optimal gate position through flow resistance and gate matching analysis, and establish a hot runner system based on this. Orthogonal test analysis shows that for deformation, the influence of holding time is extremely significant, the influence of barrel temperature and mold cavity temperature is significant, and the influence of injection time is not significant. The optimized process parameter combination A2B3C1D3 (mold cavity temperature 45 ℃, barrel temperature 250 ℃, holding time 14 s, and injection time 0.9 s)was obtained by observing the curve of maximum deformation changing with the process level. The simulation verification of the optimized process found that the maximum deformation was reduced from 0.341 0 mm to 0.212 8 mm, with an optimization rate of 37.6%, and the filling state, appearance, injection pressure all met the requirements.
Electronic relay / ABS / Simulation / Orthogonal test / Process optimization
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