Curing Kinetics of Epoxy Resin for General Aviation Aircraft Composites

DING Zhen-yuan, CHEN Shu-xian

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PDF(1935 KB)
Plastics Science and Technology ›› 2024, Vol. 52 ›› Issue (02) : 7-12. DOI: 10.15925/j.cnki.issn1005-3360.2024.02.002
Theory and Research

Curing Kinetics of Epoxy Resin for General Aviation Aircraft Composites

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Abstract

In order to obtain the curing kinetic equation and curing kinetic parameters of thermosetting epoxy resin for general aviation aircraft, the non-isothermal test of thermosetting epoxy resin was carried out by differential scanning calorimetry (DSC) at different heating rates, and the curing kinetic properties of thermosetting epoxy resin were obtained by fitting the numerical values of the experimental curve. The Ozawa-Wall-Flynn (OWF) and Kissinger-Akahira-Sunose (KAS) methods were used to determine the activation energy, and the change of apparent activation energy with the degree of curing was studied. Based on the Málek method, the curing reaction mechanism was analyzed, and the results showed that the curing behavior of the resin was in line with the Sestak-Berggren autocatalytic model. The pre-index factor (A) and reaction order (m, n) were determined by nonlinear fitting (LSR), and the curing kinetic model was established. The curing reaction rate-curing degree curve predicted by the model was compared with the experimental results, and the results showed that the predicted values of the model were basically consistent with the experimental values. Therefore, the curing kinetic model obtained can accurately describe the curing reaction process of the resin. The research work provides a reference for the manufacturing and repair process of composite materials for general aviation aircraft, and the formulation of curing process parameters.

Key words

Non-isothermal differential scanning calorimetry / Thermosetting epoxy resin / Curing kinetics / Self-catalytic model

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DING Zhen-yuan , CHEN Shu-xian. Curing Kinetics of Epoxy Resin for General Aviation Aircraft Composites. Plastics Science and Technology. 2024, 52(02): 7-12 https://doi.org/10.15925/j.cnki.issn1005-3360.2024.02.002

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