激光植球焊点剪切强度研究及断裂途径分析

激光植球焊点剪切强度研究及断裂途径分析

Journal of Guilin University of Electronic Technology ›› 2023, Vol. 43 ›› Issue (04) : 265-270. DOI: 10.16725/j.cnki.cn45-1351/tn.2023.04.003

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TN05 / TN249

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