超薄存储芯片三维堆叠封装服役可靠性研究

超薄存储芯片三维堆叠封装服役可靠性研究

Journal of Guilin University of Electronic Technology ›› 2024, Vol. 44 ›› Issue (05) : 519-524. DOI: 10.16725/j.1673-808X.2022343

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