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中文
基于铜镍逆置换的PCB化学镀镍的无钯活化瞬时启镀工艺
赵万成, 吴波, 黎德育, 夏方诠, 田栋, 李宁
Electeoplating and Finishing . 2025, (
04
): 48 -52 . DOI: 10.19289/j.1004-227x.2025.04.007