微波多腔体外壳导电胶粘接覆铜板失效原因分析与解决

微波多腔体外壳导电胶粘接覆铜板失效原因分析与解决

Electeoplating and Finishing ›› 2024, Vol. 43 ›› Issue (04) : 40-46. DOI: 10.19289/j.1004-227x.2024.04.006

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TQ153.14 / TQ436 / TN41

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